Hoku Scientific (HOKU) Gets Loan To Finance Polysilicon Plant

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09:23:27 am on October 10, 2008

Hoku Scientific has been approved for a $5 million loan with First Hawaiian Bank. The loan will help the company finance expenses incurred from the construction of its new polysilicon manufacturing plant in Idaho.  The loan, which carries a 5% interest rate, must be paid back by January 1, 2009.

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