Applied Materials just announced a collaboration with DISCO Corp to develop wafer thinning processes for manufacturing through-silicon vias in 3-dimensional semiconductors. The companies will combine respective skills to develop standardized processing procedures to lower the cost, reduce the risk and increase the speed of manufacturing next-generation through-silicon via chips.

From a company press release, here’s more about the technical side of the process, what each company will bring to the collaboration, and why it is … Read the rest