Applied Materials released its brand-new Applied Centura® Silvia™Etch system today. This new system is a step forward for Applied Materials because it allows higher performance silicon etching at a lower cost for through-silicon via (TSV) applications. The Silvia system uses the company’s proprietary time-multiplexed gas modulation (TMGM) process, resulting in a higher silicon etch rate and lower operating costs.

Ellie Yieh, Applied Materials’ VP of the Etch and Cleans Business Unit, explained why the new