Tag Archives: TSVs

EV Group To Work With Applied Materials (AMAT) On Thin Wafer Bonding

EV Group just announced that they will be working with Applied Materials (AMAT) to develop thin wafer bonding technologies that will  be used to make through-silicon vias  in three-dimensional integrated circuit (3D IC) packaging applications.

Through-silicon vias technology involves stacking chips vertically to increase package density in electronic equipment. This allow for smaller devices that can do more with less power, but there are problems with the existing technology. The wafers that are used are … Read the rest